3/20/2025 10:39:45 PM
Samsung eMMC part number 22Q2 update
Part Number |
Version |
Memory |
Working Voltage |
Interface |
Package size |
Working Temp. |
KLMCG2UCTB-B041 |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMDG4UCTB-B041 |
eMMC 5.1 |
128 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
KLM4G1FETE-B041 |
eMMC 5.1 |
4 GB |
1.8, 3.3 V / 3.3 V |
HS400 |
11 x 10 x 0.8 mm |
-25 ~ 85 °C |
KLM8G1GEUF-B04P |
eMMC 5.1 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLM8G1GEUF-B04Q |
eMMC 5.1 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLMAG2GEUF-B04P |
eMMC 5.1 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLMAG2GEUF-B04Q |
eMMC 5.1 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLMBG4GEUF-B04P |
eMMC 5.1 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLMBG4GEUF-B04Q |
eMMC 5.1 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLMCG2KCTA-B041 |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMCG2UCTA-B041 |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMDG4UCTA-B041 |
eMMC 5.1 |
128 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
KLMEG8UCTA-B041 |
eMMC 5.1 |
256 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
KLM8G1GESD-B03P |
eMMC 5.0 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLM8G1GESD-B03Q |
eMMC 5.0 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLM8G1GESD-B04P |
eMMC 5.1 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLM8G1GESD-B04Q |
eMMC 5.1 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLM8G1GETF-B041 |
eMMC 5.1 |
8 GB |
1.8, 3.3 V / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMAG1JETD-B041 |
eMMC 5.1 |
16 GB |
1.8, 3.3 V / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMAG2GESD-B03P |
eMMC 5.0 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLMAG2GESD-B03Q |
eMMC 5.0 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLMAG2GESD-B04P |
eMMC 5.1 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
KLMAG2GESD-B04Q |
eMMC 5.1 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
KLMBG2JETD-B041 |
eMMC 5.1 |
32 GB |
1.8, 3.3 V / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-25 ~ 85 °C |
KLMBG4GESD-B03P |
eMMC 5.0 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
KLMBG4GESD-B03Q |
eMMC 5.0 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 105 °C |
KLMBG4GESD-B04P |
eMMC 5.1 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
KLMBG4GESD-B04Q |
eMMC 5.1 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
KLMCG4JETD-B041 |
eMMC 5.1 |
64 GB |
1.8, 3.3 V / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
KLMCG4JEUD-B04P |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.2 mm |
-40 ~ 85 °C |
KLMCG4JEUD-B04Q |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |
KLMCG8GESD-B03P |
eMMC 5.0 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
KLMCG8GESD-B03Q |
eMMC 5.0 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 105 °C |
KLMCG8GESD-B04P |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
KLMCG8GESD-B04Q |
eMMC 5.1 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 105 °C |
KLMDG8JEUD-B04P |
eMMC 5.1 |
128 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.2 mm |
-40 ~ 85 °C |
KLMDG8JEUD-B04Q |
eMMC 5.1 |
128 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |